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封装方向
  • 面议
  • 上海
  • 20 Mar 2024
现在申请

工作职能:

1.Participate in the Chip packacing solution desian , and responsible for the DFM implementation and competitiveness of chip packaging solutions; 

2. Responsbhle tor cip padkadino re ted N manactumd and enainermg proces ualty asuance, proces taure amays, proces mprovemnt and mpementaton, and completethe tanste from NPI to svM and HVM production; 

3.Responsible for the development of new chip materials and new packaging technology applications;

4. Responsible for reulary oroanizing supplier exchandes e.a.0TR),sortind out supolier capabilities, and providin capabity support for packadind solution desian5.通过技术维度支持 5.Support the supply chain and procurement system through the technical dimension to maintain a competitive supplier partnership.

任职资格:

1.Major in electronics, materials, etc., master's degree or above;

2.More than 5 years of relevant work experience in packaging;

3.Experience in packaging factory, foundry supplier and material supplier is preferred; 

4.Familiar with the process flow and key process sites of different packaging types, and experience in product reliability is preferred;

5.Familiar with statistical analysis methods, experience in packaging process analysis tools is preferred.

现在申请
我们在哪?
  • 上海
  • 杭州
  • 北京
  • 成都
  • 西安
  • 无锡
上海
上海市虹口区东大名路501号白玉兰广场办公楼9楼
T: 021-60293189
E: service@dtjintl.com
如何找到我们
杭州
杭州市拱墅区杭州新天地商务中心5幢西楼1008室
T: 0571-87325921
E: service@dtjintl.com
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北京
北京市朝阳区朝阳门外大街中认大厦
T: 15711188366
E: service@dtjintl.com
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成都
四川省成都市锦江区国际金融中心IFS三号楼4108单元
T: 18011315388
E: service@dtjintl.com
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西安
西安市碑林区南关正街88号长安国际E座
T: 029-85210308
E: service@dtjintl.com
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无锡
无锡市梁溪区人民中路139号恒隆广场写字楼2座
T: 15190201061
E: service@dtjintl.com
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